nyom lebont megöl cu ni sn Tanzánia Furcsa Felöltő
Tetrahedron of the Sn-Ag-Cu-Ni phase equilibria at 210°C. | Download Scientific Diagram
Cu-Ni-Sn: A Key System for Lead-Free Soldering
In situ study on Cu–Ni cross-interaction in Cu/Sn/Ni solder joints under temperature gradient | Journal of Materials Research | Cambridge Core
Materials | Free Full-Text | Reactions in Electrodeposited Cu/Sn and Cu/Ni/ Sn Nanoscale Multilayers for Interconnects
Cu–Ni–Sn–Si alloys designed by cluster-plus-glue-atom model - ScienceDirect
Experimental Determination of the Sn-Cu-Ni Phase Diagram for Pb-Free Solder Applications | SpringerLink
Different Diffusion Behavior of Cu and Ni Undergoing Liquid-solid Electromigration
Cu-Ni-Sn: A Key System for Lead-Free Soldering
Calculated isothermal section of Sn-Cu-Ni phase diagram at 800°C... | Download Scientific Diagram
Cu–Ni–Sn isotherm phase diagram at 240 °C based on the previous works... | Download Scientific Diagram
Interfacial reactions and mechanical properties of transient liquid-phase bonding joints in Cu/Sn/Ni(P) and Ni/Sn/(OSP)Cu structures for power modules | SpringerLink